User interface substrate for handset device

ABSTRACT

A substrate ( 56 ) for a handset device ( 10 ) includes a keypad contact array ( 108 ) on the substrate ( 56 ) and a display electrode pattern ( 604 ) on the substrate ( 56 ). In addition, in one example, the substrate ( 56 ) for a handset device ( 10 ) may include a first surface and a second surface. A keypad contact array ( 108 ) and a display electrode pattern ( 604 ) may be included on the first surface ( 96 ) of the substrate ( 56 ). A display ( 52 ) may be operatively coupled to the display electrode pattern ( 604 ). A portion of the substrate ( 56 ) may define at least a portion of an audio port ( 274 ).

RELATED CO-PENDING APPLICATIONS

This application is related to co-pending applications entitled “HANDSETKEYPAD”, filed on even date, having docket number CS29452VLT, Ser. No.______, having inventors Mark Finney and Steve Emmert, owned by instantAssignee and is incorporated herein by reference; and “HANDSET DEVICEWITH LAMINATED ARCHITECTURE”, filed on even date, having docket numberCS29435VLT, Ser. No. ______, having inventor Steve Emmert, owned byinstant Assignee and is incorporated herein by reference.

FIELD OF THE INVENTION

The invention relates generally to mobile devices and, moreparticularly, to handset devices that employ displays and other userinterfaces.

BACKGROUND OF THE INVENTION

By way of example, the expansion of the cellular coverage in emergingmarkets requires phone designs that are very low cost in both materialand conversion cost. Furthermore, success in these markets will requirephone designs that are compelling and competitive in terms of design,proportions and appearance. Existing low cost phone designs typicallyuse design approaches that have additional major housing components andinternal component stacking that result in increased thickness.

Common methods of phone construction typically incorporate separatedisplay module assemblies and printed circuit board assemblies, loadedinto a housing assembly that includes a back cover and a front covertypically secured with screws, snap fit parts, or similar interlockingmeans. Using multiple separate sub-module assemblies and housingstructures can be expensive compared with low cost product demands ofconsumers.

Also, the telephone microphone audio port and the front and rear speakerports must be well sealed. If the seals are broken there might be anunwanted path from speaker to microphone which causes unwanted echosounds, or the loudness and frequency response could be affected. Inconventional phones the front housing is used to seal the phone, butthis approach adds cost and size to the phone.

Accordingly improved mobile device structures and method of making suchstructures would be desirable.

In addition, with respect to keypads, keypads are known to be used inmany types of devices, including but not limited to, handheld devicessuch as cell phones, non-handheld devices such as desktop phones, andany other device that employs keys as part of a user interface. Problemscan arise with keypad usability in mobile devices and other deviceswhere, for example, a user is not looking at the keypad. Some handsetdevices are known that include bell keypad layouts that include thenumbers 0-9 in addition to other function keys such as “send” keys andother function keys and include tactile key dividers. One example may befound on the PEBL™ flip phone sold by Motorola, Inc. Such phones mayinclude raised silicone portions that are in s-curve shapes andcorresponding mirrored s-curve shapes. The two shapes are separated downthe center of the keypad such that non-horizontal numbers 1, 5 and 3 aresurrounded by a plurality of the s-curve and mirrored s-curve raisedsilicone protrusions. As such, the raised protrusions may be in aparallel orientation above and below non-horizontal keypad numbers 1, 5and 3 with a space between the s-portion and mirrored s-portion centeredbelow center number of the phone such as numbers 2, 5, 8 and 0. Thisconfiguration can assist a user when they are not looking at the phoneto provide suitable vertical tactile separation between numbers in avertical direction. In a horizontal direction however since the raisedsilicone portion is curved a user may inadvertently slip down to a nextrow of numbers instead of selecting the number in the horizontal row.For example, numbers in the horizontal row 1, 2 and 3 versus numbers inthe second horizontal row 4, 5 and 6 can potentially be inadvertentlyselected since the raised tactile separations curve down and betweenhorizontal rows.

Other keypad designs are known which use, for example, the keysthemselves such as raised thin buttons that extend in a straight linehorizontally. However, since the raised portion serves as the key andsince the raised portions are horizontally straight across, it can bedifficult to distinguish horizontally which number is being selectedwithout looking at the phone. Other designs are also known which employraised depressible button that are configured in a “v” shape in ahorizontal line configuration. However, as with the type above, theseraised sections are the keys themselves and can require separatecomponents for each of the keys resulting in separate pieces potentiallyincreasing the cost of the device, increasing the manufacturingcomplexity of the device and decreasing the reliability of the device.

Accordingly, a need exists for an improved keypad.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention and the corresponding advantages and featuresprovided thereby will be best understood and appreciated upon review ofthe following detailed description of the invention, taken inconjunction with the following drawings, where like numerals representlike elements, in which:

FIG. 1 is an exploded assembly view, shown from the front perspective,of one example of a handset device depicting one embodiment of theinvention;

FIG. 2 is an exploded assembly view, shown from the rear perspective, ofone example of a handset device depicting one embodiment of theinvention;

FIG. 3 is a lengthwise cross section of an assembled version of thehandset device of FIG. 1 taken along the lines 3-3 depicting oneembodiment of the invention;

FIG. 4 is a widthwise cross section of an assembled version of thehandset device of FIG. 1 taken along lines 4-4 depicting one embodimentof the invention;

FIG. 5 is an enlarged view of part of the cross section shown in FIG. 4depicting one embodiment of the invention;

FIG. 6 is a schematic diagram of part of a laminated front sub-assemblyof one example of a handset device depicting one embodiment of theinvention;

FIG. 7 is an exploded assembly view, shown from the front perspective,of part of the handset device of FIG. 1 depicting one embodiment of theinvention;

FIG. 8 is an exploded assembly view, shown from the rear perspective, ofthe handset device of FIG. 2 depicting one embodiment of the invention;

FIG. 9 is an exploded assembly view, shown from the front perspective,of part of the handset device of FIG. 1 depicting one embodiment of theinvention;

FIG. 10 is an exploded assembly view, shown from the rear perspective,of part of the handset device of FIG. 2 depicting one embodiment of theinvention;

FIG. 11 is a widthwise cross section of the speaker cavity of anassembled version of the handset device of FIG. 8 taken along lines11-11 depicting one embodiment of the invention;

FIG. 12 is a perspective view of a portion of a handset device shown inFIG. 1 in accordance with one embodiment of the invention; and

FIG. 13 is a front view of a phone of FIG. 1 assembled illustrating oneexample of a keypad in accordance with one embodiment of the invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Briefly, a substrate for a handset device includes a keypad contactarray on the substrate and a display electrode pattern on the substrate.In addition, in one example, the substrate for a handset device mayinclude a first surface and a second surface. A keypad contact array anda display electrode pattern may be included on the first surface of thesubstrate. A display may be operatively coupled to the display electrodepattern. A portion of the substrate may define at least a portion of anaudio port.

As such, the substrate combines a display electrode pattern, such as isuseful for laminated display, and as the keypad contact array. Thisarchitecture provides yield a thin, space efficient, and cost effectivedesign that is further useful as a component in a thin and costeffective handset device. The substrate architecture facilitatesdesigning a display around an audio port to create a unique appearancewhile implementing a necessary function in a space efficient manner.Other advantages will be recognized by one of ordinary skill in the art.

FIG. 1 is an exploded assembly view, shown from the front perspective,of one example of a handset device 10 depicting one embodiment of theinvention. A rear perspective of the same handset device 10 is shown inFIG. 2. The handset device 10 can be embodied as any suitable handsetdevice having any suitable functionality, including but not limited to,a wireless telephone, an internet appliance, a handheld computer, apersonal digital assistant, a digital entertainment device, a radiocommunication device, a tracking device, a personal training device, aglobal positioning device, or a combination thereof. For purposes ofillustration only, a wireless telephone device is exemplified.

The handset device 10 includes a laminated front sub-assembly 15 and arear housing 20 supporting the laminated front sub-assembly 15 where anintegrated circuit substrate 24, a battery 28, and a speaker 32 are heldadjacent to each other in a non-stacked arrangement in the rear housing20. The laminated front sub-assembly 15 includes, in one example, asheet 36 and a user interface substrate 56. The laminated front assembly15 may also include an adhesive sheet 40. Adhesive sheet 40 may be apressure sensitive adhesive and may be in multiple sections. As shown,adhesive sheet 40 is separated into three sections, a small strip at thetop, a small strip at the bottom, and a main “A” shaped section throughthe middle. Different thicknesses of adhesive may be needed in differentareas based upon the underlying structure to which they are adhered. Thelaminated front assembly may also include a keypad substrate 44 (e.g.,an elastomeric substrate such as silicone or other suitable material), akeypad contact array 48, a display 52, a user interface substrate 56that supports the display 52, a user interface substrate adhesive 60,and a metal chassis 64. The handset device 10 may further include amicrophone 68, a charging jack 72, a top antenna 76, a bottom antenna80, a battery cover 84, integrated circuit substrate retaining screws88, and rear housing retaining screws 92.

The user interface substrate 56 includes a top surface 96 and a bottomsurface 204 (see FIG. 2). The user interface substrate 56 furtherincludes an upper part 100 and a lower part 104. The display 52 isoperatively coupled to the upper part 100 of the user interfacesubstrate 56. The display 52 is coupled to a display electrode pattern604 (see FIG. 6, discussed below) that is formed on the top surface 96of the upper part 100 of the user interface substrate 56. A keypadcontact array 108 is formed in the lower part 104 of the user interfacesubstrate 56. The keypad contact array 108 may be a patterned,conductive material such as exposed copper or other electricallyconductive material from a layer of the user interface substrate 56,such as a printed circuit board. The user interface substrate 56 may bea printed circuit board (PCB) comprising a resin-based material, such asFR4, or any other suitable material. For example, the user interfacesubstrate 56 may be a PCB with a patterned copper alloy layer on the topsurface 96. The user interface substrate 56 may have a patterned,conductive material on both the top surface 96 and the bottom surface204. Other substrate materials may also be used, such as resin-basedcomposite material, polyester, flexible substrate material, ceramic, orany other suitable substrate material as is known in the art. Thepatterned conductive material may alternatively include a conductive inklayer. Other materials for the user interface substrate 56 include FR4Type No. MCL-E-67, manufactured by Hitachi Chemical Co. or Pyralux®manufactured by DuPont. Other materials for the keypad contact array 48include ESP-10 Tactile Sheets manufactured by Panasonic or SK5AB SeriesContact Sheets manufactured by Alps Electric, Inc.

The user interface substrate 56 may further include informationallighting for a keypad and display 52. For example, two LED's (not shown)may be operatively coupled to ends of light guides 507 (see FIG. 5) onthe user interface substrate 56. Two narrow light guides 507 may beplaced along the right and left sides of the top surface of the userinterface substrate 56 and retained by stamped metal brackets 112 thatwrap around the edges of the user interface substrate 56. The lightguides 507 are aligned to the LED's in order to carry light the fulllength of the handset device 10 and to distribute that light into thekeypad and on top of the display 52. The metal brackets 112 may alsoserve as light reflectors.

The metal chassis 64 includes a top surface 116 and a bottom surface 208(see FIG. 2). The metal chassis 64 may be a stamped metal sheet such asstainless steel or any suitable material, such as aluminum, copper,steel, or alloys thereof, and may be machined by any other process, suchas casting, forging, drilling, cutting, or molding, as is known in theart.

During assembly of the laminated front sub-assembly 15, the userinterface substrate 56 is operatively coupled to the metal chassis 64.For example, the bottom surface 204 of the user interface substrate 56may be adhered to the top surface 116 of the metal chassis 64 via theuser interface substrate adhesive 60. The user interface substrateadhesive 60 may be a sheet of adhesive or a composite film havingtwo-sided adhesive, such as 9495 MP manufactured by 3M. The userinterface substrate adhesive 60 may be any type of adhesive, as known inthe art, such pressure-sensitive adhesive, heat cured adhesive, orultraviolet cured adhesive. Alternatively, the user interface substrate56 may be assembled to the metal chassis 64 using a combination ofphysical interlocks, such as screws, formed hooks, snap catches,soldering or welding, either in place of or combined with the userinterface substrate adhesive 60.

The metal chassis 64 may provide structural strength and rigidity to thelaminated front sub-assembly 10. The metal chassis 64 also providesfeatures to facilitate ease of assembly and disassembly of the handsetdevice and for shielding structure between components in the rearhousing, such as the top and bottom antennas 76 and 80, and the front ofthe handset device 10. However, as an alternative, the metal chassis 64may be eliminated. For example, a metal layer, such as an inner copperlayer in a multiple level PCB, may be added to the user interfacesubstrate 56, to function as a grounding plane/shield and to strengthenthe user interface substrate 56. In addition, mechanical couplingfeatures, such as slots, tabs, and screw bosses, may be formed, molded,cut, or embedded in the user interface substrate 56 so that the userinterface substrate 56 may be operative to movably retain screws, tabs,slots, or other features of the rear housing 20.

The display 52 is operatively coupled to the top surface 96 of the userinterface substrate 56, such as by a conductive lamination adhesive (seeFIG. 6) or other suitable attachment technique. The display 52 has a topsurface 136 and a bottom surface 702 (see FIG. 7). The display 52, as asub-assembly, may be coupled to the user interface substrate 56 by, forexample, adhering the back of the display 52 to the user interfacesubstrate 56 using the lamination adhesive. In another embodiment, aconductive adhesive may be used to bond the bottom surface 702 of thedisplay 52 to the display electrode pattern 604 of the user interfacesubstrate 56. Layers of the display 52 may be laminated onto the userinterface substrate 56. For example, where the display 52 is anelectrophoretic display, the layers of the electrophoretic display (EPD)may be sequentially laminated directly to the user interface substrate56 as shown in FIG. 6 and as described below. In the case of an EPDdisplay, or similar laminar display, the display electrode pattern 604(see FIGS. 6 and 7) on the top surface of the user interface substrate56 may be used as a backplane electrode to control the display 52.

The keypad contact array 48 is secured to the top surface 96 of the userinterface substrate 56. The keypad contact array 48 has a top surface148 and a bottom surface 216 and may further include topologicalfeatures such as depressible domes as known in the art. The keypadcontact array 48 may include, for example, an array of metal domes 152held in flexible carrier sheet as is known in the art. For example, thekeypad may include stainless steel domes 152 in a plastic carrier sheet.The domes 152 need not be metal but may include other conductivematerials, or combinations of materials, such as carbon or graphite. Thekeypad contact array 48 may be adhered to the top surface 96 of the userinterface substrate 36. The plastic carrier sheet is laminated to thePCB throughout the entire back surface 216, aside from where the metaldomes actually reside. Typically this is accomplished via a screenprinted pressure sensitive adhesive that has been applied to the backsurface 216 of the plastic carrier film. Typically, this adhesive isalso used to actually hold the metal domes in place on the plasticcarrier sheet. The array of domes 152 is thereby suspended over thekeypad contact array 108 of the user interface substrate 56. When acontact dome in the array 48 is depressed, an electrical connection ismade between the conductive material of the dome and the conductivematerial of the keypad contact array 108.

The keypad substrate 44 may be used to provide tactile cues for a userof the keypad 1200 (see FIG. 12). The keypad substrate 44, which may beof a silicone material or other suitable material, may be secured eitherto the keypad dome array 48 or to the user interface substrate 56.However, preferably, the top surface 120 of keypad silicone substrate 44is attached to the back surface 224 of sheet 36. The keypad substrate 44includes a top surface 120 and a bottom surface 220 (see FIG. 2). Thetop surface 120 of the keypad substrate 44 may include suitably shapedkey dividers. In this example they are shown as arced key dividersextending outwardly from the top surface 120 of keypad siliconesubstrate 44. These arced key dividers may extend through arced slots172 in the sheet 36 in the assembled handset device 10 to provideimproved tactile feedback for the user of the handset device 10.

The sheet 36 is secured to the user interface substrate 56 via adhesivesheet 40 to form the laminated front sub-assembly 15. In addition thesheet can be adhered to brackets 112. However, a non-adhesive sheet canbe used or any suitable coupling mechanisms. The sheet 36 has a topsurface 156 and a bottom surface 224 (see FIG. 2). The sheet 36 has anupper part 160 and a lower part 164. The sheet 36 is planar and has noupwardly or downwardly extending side walls. The sheet 36 may be securedto the user interface substrate 56. For example, the perimeter of thebottom surface 224 of the sheet 36 may be adhered to the top surface 96of the user interface substrate 56 through the adhesive sheet 40. Forexample, the adhesive sheet 40 bonds to upper and lower edges of theuser interface substrate 56, to the right and left edges of the lightguide brackets 112, and to the complete perimeter of the display 52. Asa result, a complete perimeter of adhesive sheet 40 may be assembled toprevent dust from entering the handset device 10, in general, and thedisplay viewing area, in particular. The adhesive sheet 40 may be asheet of adhesive or a composite film having two-sided adhesive. Theadhesive sheet 40 may be any type of adhesive, as known in the art, suchas pressure-sensitive adhesive, heat cured adhesive, or ultravioletcured adhesive. For example, the adhesive sheet 40 may be a materialsuch as 9495 MP manufactured by 3M.

The sheet 36 provides a rugged surface capable of withstanding directcontact with the user and exposure to the environment. The sheet 36 maybe a hard coated transparent material, such as poly carbonate, acrylic,or polyethylene terephthalate. Other material such as Tupilon NF2000,manufactured by Mitsubishi Engineering-Plastics Corporation and HP92S,manufactured by GE Plastics may also be used if desired. The sheet 36may serve as an exterior surface for user interaction with the keypad 32and as a transparent protective cover for the display 52.

To facilitate operator use of the handset device 10, the sheet 36 mayinclude operative indicia 226 (see FIG. 2 as discussed below), such asalphanumerical graphics or other graphics to facilitate operation of thedevice 10. The sheet 36 may include a navigation key 168, useful, forexample, to navigate menus on the handset device 10. The navigation key168 may be molded into the sheet 36 or may be mechanically coupled tothe laminated front sub-assembly 15.

The sheet 36 serves as a protective lens for the display 52. Inaddition, the combination of the sheet 36 and the adhesive sheet 40seals out dust and other contaminates from the display 52. The sheet 36may be sized to fit over the display 52 or the keypad or both thedisplay 52 and keypad. The sheet 36 may be sized to fit inside the rearhousing 20. The sheet 36 may be sized to extend over the exterior sidewalls 304 (see FIG. 3) of the rear housing 20.

It will be recognized by one skilled in the art that a top sheeting, notshown, such as an anti-scratch film or a protective shipping film, maybe placed on top of the sheet 36 within the scope of the invention.

The rear housing 20 is assembled to support the laminated frontsub-assembly 15. The rear housing 20 includes a base wall 230 (see FIG.2) having a top surface 176 and a bottom surface 228 (see FIG. 2),external side walls 178 extending upward, and a ridge 180 (see also FIG.5) on external side walls adapted to receive the sheet 36 of thelaminated front sub-assembly 15. The rear housing 20 further includesinternal side walls 182 adapted to support the metal chassis 64 of thelaminated front sub-assembly 15 or to support other components held inthe rear housing 20, such as the integrated circuit substrate 24, thespeaker 32, the top and bottom antennas 76 and 80, and the charging jack72. The internal side walls 182 are also adapted to form a batterycompartment 184 within the rear housing 20 yet without a base wall 230underlying the battery 28 such that the battery 28 can be servicedwithout disassembly of the rear housing 20 from the laminated frontsub-assembly 15. The rear housing 20 may be a resin-based material thatis molded using techniques well known in the art of injection molding.The rear housing material may be a single material or a compositematerial. For example, the rear housing 20 may include Lexan EXL1414,manufactured by GE Plastics and Bayblend T85, manufactured by Bayer.

The rear housing 20 is adapted to receive relatively large components,such as the integrated circuit substrate 24, the battery 28, and thespeaker 32, such that these components may be held adjacent to eachother in the rear housing 20 in a non-stacked configuration in the rearhousing 20. That is, no member of the group of the integrated circuitsubstrate 68, the battery 100, and the speaker 32 is stacked on any partof another member. The battery 28 is retained in the rear housing 20between the speaker 32 and the integrated circuit substrate 24. Thesecomponents occupy a relatively large amount of the volume of the rearhousing 20. In addition, due to the thin profile achieved by thelaminated front sub-assembly 15, thicknesses of the integrated circuitsubstrate 24, the battery 28, and the speaker 32, once assembled, maydetermine the relative height of the assembled handset device 10. Bydistributing the integrated circuit substrate 24, the battery 28, andthe speaker 32 over the length of the rear housing 20 in an adjacent andnon-stacked arrangement, the thickness of the assembled handset device10 is minimized.

The integrated circuit substrate 24 is assembled to the metal chassis 64via screws 88. Alternatively, it could be held in rear housing 20 viascrews, or snap catches, or similar mechanism. The integrated circuitsubstrate 24 is further operatively coupled to the laminated frontsub-assembly 15 by screws to metal chassis as described above. Theintegrated circuit substrate 24 has a top surface 186 and a bottomsurface 232 (see FIG. 2) and is adapted to carry a plurality ofintegrated circuit packages, dies or other electronic devices. Theintegrated circuit substrate 24 may be a printed circuit board (PCB)comprising a resin-based material, such as FR4, with a patterned,conductive material thereon or any suitable material. For example, theintegrated circuit substrate 24 may be a PCB with a patterned copperlayer on the top surface 186. The integrated circuit substrate 24 mayhave a patterned, conductive material on both the top surface 186 andthe bottom surface 232 and may be a multiplayer printed circuit boardsuch as those provided by WUS and Unimicron Technology Corp or any othersuitable manufacturer. Other substrates materials may be used, such asresin-based composite material, flexible substrate material, or ceramic,as is known in the art. The integrated circuit substrate 24 may carryand interconnect a primary transceiver chip set, or engine, for thehandset device 10. The integrated circuit substrate 24 may carry any ora combination of electronic devices, including central processing units,memory, modulators, and demodulators as known in the art. The integratedcircuit substrate 24 may be electrically coupled to the user interfacesubstrate 56 via connector 188 on the top surface 186 of the integratedcircuit substrate 24. The integrated circuit substrate 24 may bemechanically coupled to the metal chassis 64 using screws 88 retainedthreaded in bosses 1020 (see FIG. 10) on the metal chassis 64. The metalbosses 1020 may also serve to connect electrical ground between theintegrated circuit substrate 24 and the metal chassis 64, therebygrounding the metal chassis 64 for purposes of shielding the substrate56 from unwanted electrical radiation, enhancing the antenna radiationpattern, and providing an electrical path for electrostatic discharges.The bosses 1020 may be press fit with the metal chassis or may beintegral with the chassis. The integrated circuit substrate 24 may beaccessible for repair or replacement by removing the rear housing 20 andbattery 28.

The battery 28 is held in the rear housing 20 in the batterycompartment. The battery 28 is further coupled to the integrated circuitsubstrate 24 through spring contacts as known in the art. The battery 28may be any electrical storage cell as is known in the art. The battery28 may be rechargeable. The battery cover 84 may be mechanically coupledto the rear housing 20 by catch features 189 on the battery cover 84.The battery 28 may be easily removed by removing the battery cover 84.

The speaker 32 is held in the rear housing 20. The speaker 32 is furthercoupled to the integrated circuit substrate 24 using electricalconnectors 238 that pass through metal chassis 64 and user interfaceadhesive 60 and connect with conductive pads on the bottom of the userinterface substrate 56. The conductive pads are coupled to electricallyconductive traces that are connected with the integrated circuitsubstrate through connectors 268 and 188. The audio output side 190 ofthe speaker 32 is disposed toward the front of the handset device 10while the back side 236 (see FIG. 2) of the speaker 32 is held by therear housing 20. The speaker 32 may be of any type known in the art suchas solid state speaker, a ceramic speaker, or a wound coil speaker. Thespeaker 32 may be used, for example, to provide low volume phone audio,loud speaker audio, ring tone audio, or vibration. The speaker 32 mayfurther include electrical connectors 238 (see FIG. 2), such as springconnectors.

Top antenna 76 and bottom antenna 80 may be held in the rear housing 20.The top antenna 76 may be further coupled to the integrated circuitsubstrate 24 through the user interface substrate 56 in a similar manneras the speaker. The coupling to the antennas on the user interfacesubstrate 56 may take the form of controlled impedance transmissionlines, achieved by employing coplanar waveguide transmission lineshaving impedance largely defined by the spacing between conductor traceson a single layer, which are suitable for low cost assemblies, or bymultilayer transmission line structures such strip-lines ormicrostrip-lines. The bottom antenna may be coupled in a similar manneras the speaker and top antenna if desired or in any other suitablemanner. For example, the bottom antenna 80 can be directly coupled toelectrical contacts on bottom of the integrated circuit substrate 24, orother surface thereof. The two antenna elements 76 and 80 may beattached to the rear housing 20 on the bottom surface 176 of the housing20. Alternatively, a single antenna may be used. The antennas 76 and 80may include integral connectors 192 for operatively coupling theantennas 76 and 80 to the laminated front sub-assembly 15. Theconnectors 192 may be in the form of spring connectors wherein thestamped metal is shaped to bend under loading. In the assembled handsetdevice 10, the connectors 192 pass through electrical ports 246 (seeFIG. 2) in the metal chassis 64 to contact the user interface substrate56. Force exerted on the connectors 192 from the rear housing 20 holdthe connectors 192 in place while the bending, or spring action, of thespring connector insures electrical connectivity without the need forsoldering. Dual planar antennas are shown as top and bottom antennas 76and 80 and are of stamped metal although other antenna types, as knownin the art, may be used. Dual planar antennas may be useful in a handsetdevice 10 with a full length shield as defined by the metal chassis 64.

A microphone 68 may be held in the rear housing 20 in any suitablemanner. The microphone 68 may be coupled to the integrated circuitsubstrate 24. For example, the microphone 68 may be electrically coupledto the integrated circuit substrate 24 by, for example, soldering leadwires from the microphone 68 directly to the integrated circuitsubstrate 24. The microphone 68 may be held in the rear housing 20 byinternal side walls 182 in the rear housing 20 adapted to support themicrophone 68. Internal side walls 182 in the rear housing 20 mayfurther support the microphone 68 against the user interface substrateadhesive layer 60 secured to the user interface substrate 56. A chargingjack connector 72 is also held in the rear housing 20 and may be securedto the integrated circuit substrate 68. The microphone is held inprimarily by press fit of the surrounding microphone grommet into aformed feature in the metal chassis 64, as depicted by feature 285.Features in housing 20 apply pressure to the back of microphone to sealit against back surface 204 of substrate 56.

FIG. 2 is an exploded assembly view, shown from the rear perspective, ofone example of a handset device depicting one embodiment of theinvention. Further to the embodiments described above, the rearperspective view of the handset device 10 better illustrates certainaspects.

Operative indicia 226 may be applied to the sheet 36. For example,decorative ink may be applied to the bottom surface 224 of the sheet 36to provide color and decoration to the front of the handset and toprovide operative indicia 226, such as graphics, to aid operation of thehandset device 10. An opening in the decorative ink provides a viewingwindow for the display 52. Alternatively, decals, appliqués, or othergraphic films, paints, or coatings may be used as known in the art.

The bottom surface 220 of the keypad silicone substrate 44 may includeextensions 242, or plungers, that actuate the domes 152 of the keypaddome array 48 when a user exerts force on the keypad silicone substrate44.

To facilitate passage of electrical signals between components or layerswithout cabling or soldering, electrical ports may be defined instructures within the handset device 10. For example, the metal chassis64 may define electrical port 246 for passing through the connector 192of the upper antenna 76. Similarly, the user interface substrateadhesive 60 may define electrical port 250 that, upon assembly of themetal chassis 64 with the user interface substrate adhesive 60, extendsthe antenna electrical port to the user interface substrate 56.Electrical contact pad 254 may be included on the bottom surface 204 ofthe user interface substrate 56 as a conductive path and accepts theantenna connector 192. The antenna connector 192 is held against thecontact pad 254 by mechanical force applied by the rear housing 20contacting the antenna 76 when the handset device 10 is assembled.

Similarly, the metal chassis 64 may define electrical port 258 forpassing through the connector 238 of the speaker 32. The user interfacesubstrate adhesive 60 may define electrical port 262 that, upon assemblyof the metal chassis 64 with the user interface substrate adhesive 60,extends the speaker electrical port to the user interface substrate 56.Contact pad 266 may be included on the bottom surface 204 of the userinterface substrate 56 as a conductive pad to accept the speakerconnector 238. The speaker connector 238 is held against the contact pad266 by mechanical force applied by the rear housing 20 contacting thebottom side 236 of the speaker 32 when the handset device 10 isassembled.

A connector 268 for the integrated circuit substrate 24 may be securedto the bottom surface 204 of the user interface device 56. An electricalport 272 for passing the connector 268 may be defined in the metalchassis 64. After the metal chassis 64 and the user interface substrate56 are assembled, the electrical connector 188 of the integrated circuitsubstrate 24 may be plugged into the user interface device connector 268to operatively connect the substrates.

Electrical components 1002 (see FIG. 10), including drivers for thedisplay 52, may be secured to lower part 104 of the bottom surface 204of the user interface substrate 56. However, the upper part 100 of thebottom surface 204 of the user interface substrate 56 (the side oppositefrom the display 52) may be kept free from components in order tofacilitate lamination of an electrophoretic display film 52.

Referring also to FIG. 3 and FIG. 11, to facilitate passage of soundbetween the speaker 32 and outside the handset device 10 and between theoutside of the handset device 10 and the microphone 68, microphone audioport 316 and speaker audio port 320 may be defined by stacked openingsin layers of the laminated front sub-assembly 15, the adhesive sheet 40and metal chassis (if they are used). For example, for the speaker 32,audio port portion 274 is defined by the metal chassis 64, audio portportion 276 is defined by the user interface substrate adhesive 60,audio port portion 278 is defined by the user interface substrate 56,audio port portion 280 is defined by the adhesive sheet 40 and audioport portion 282 is defined by the sheet 36. It will be recognized thatFIG. 11. does not show detail of all the layers above the speaker forease of description purposes. For example it does not show display 52nor adhesive sheet 40 that form portions of the ports. The assembly ofthe handset device 10 creates a continuous audio port through thehandset device between the audio output side 190 of the speaker 32 andthe top surface 156 of the sheet 36 by vertically stacking sections ofaudio port portions defined in each layer. In similar fashion, for themicrophone 68, audio port portion 285 is defined by the metal chassis64, audio port portion 286 is defined by the user interface substrateadhesive 60, audio port portion 288 is defined by the user interfacesubstrate 56, audio port portion 292 is defined by the adhesive sheet40, and audio port portion 294 is defined by the sheet 36. The assemblyof the handset device 10 creates a continuous microphone audio portthrough the handset device between the microphone 68 and the top surface156 of the sheet 36. The microphone 68 is surrounded by a rubbergrommet, as shown in FIG. 3. The grommet seals circumferentially to thebody of the microphone via interference fit, and also sealscircumferentially to the metal chassis 64 via interference fit in formedfeature 285, and seals via pressure to back side 204 of substrate 56,the pressure being applied by a rib wall 182 in rear housing 20.

A gasket 296 seals the audio output side 190 of the speaker 32 toprevent audio leakage or echo between the speaker 32 and microphone 68in the handset device 10, and sealing an audio cavity at the interfaceof the chassis 64 to the housing 20. When the handset device 10 isassembled, the internal side walls 182 in the rear housing 20mechanically support the speaker 32 against the gasket 296. The audioport 282 is sealed against leakage by the adhesive layers 60 and 40around the entire perimeter of the metal chassis 64, the user interfacesubstrate 56, and the sheet 36 in the porting holes.

FIG. 3 is a lengthwise cross section of an assembled version of thehandset device of FIG. 1 depicting one embodiment of the invention. Thecross section shows a thin, laminated front sub-assembly 15 including alaminate of the metal chassis 64, the user interface substrate adhesive60, and the user interface substrate 56 onto which the keypad and thekeypad silicone substrate 44 are laminated in a lower part 304 of thehandset device 10 and onto which the display 52 is laminated in an upperpart 308 of the handset device 10. The adhesive sheet 40 and the sheet36 are laminated across lower part 304 and upper part 308 to completethe laminated front sub-assembly 15. Among other advantages, thelaminated front sub-assembly 15 provides user interface functions ofdisplay and keypad entry while sealing and protecting the contents ofthe handset and while exhibiting a very thin profile.

The cross section shows the rear housing 20 supporting the laminatedfront sub-assembly. In particular, external side walls 178 support thesheet 36, while internal side walls 182 support other layers of thelaminated front sub-assembly such as the metal chassis 64 and the userinterface substrate 56. The rear housing 20 holds large components suchas the integrated circuit substrate 24, battery 28, and speaker 32.Internal side walls 182 support the speaker 32 and the integratedcircuit substrate 24. Internal side walls 182 define the batterycompartment 184 (see FIG. 1) while supporting the battery 28,indirectly, by coupling to the battery cover 84. In addition, themicrophone 68 is supported by internal side walls 182. The top antenna76 and the bottom antenna 80 are supported by the base wall 230 of therear housing 20.

The integrated circuit substrate 24, battery 28, and speaker 32 are heldadjacent along the length of the handset device 10 while not stacking.This arrangement minimizes the thickness of the handset device 10. Thetop antenna 76 and the bottom antenna 80 are held along the bottom ofthe handset device 10 while the metal chassis 64 is positioned betweenthe antennas 76 and 80 and the sheet 36 of the handset device 10.Speaker audio port 320 and microphone audio port 316 are defined byports in several layers of the laminated front sub-assembly 15 asdescribed above.

FIG. 4 is a widthwise cross section of an assembled version of thehandset device of FIG. 1 depicting one embodiment of the invention. FIG.5 is an enlarged view of part of the cross section shown in FIG. 4depicting one embodiment of the invention. The interface between thesheet 36 and the rear housing 20 is shown in detail. In this example, asupporting surface is located along sidewalls of the rear housing tosupport the sheet 36. In this example, the ridge 180 is formed in theexterior side wall 178 of the rear housing 20 to receive the sheet 36such that sheet 36 partly extends over the exterior side wall 178 of therear housing 20 while fitting inside the rear housing 20. Alternatively,the rear housing 20 may simply present a flat surface, without notching,such that, if the sheet 36 is sized to extend on top of the exteriorside wall 178, then the sheet 36 will not fit inside the rear housing20. Alternatively, the sheet 36 may be sized to fit inside the rearhousing 20 without extending over the exterior side wall 178. Inaddition, the edge 504 of the sheet 36 is chamfered to provide a smoothinterface edge. It will be appreciated by one skilled in the art thatother embodiments of the interface between the sheet 36 and the rearhousing 20 are possible within the scope of the invention.

The battery cover 84 mechanically couples to the rear housing 20 suchthat the rear housing 20 supports the battery 28 via the battery cover84. While a latch arrangement 506 between the rear housing 20 and thebattery cover 84 is depicted, it will be appreciated by one skilled inthe art that other embodiments of the interface between the rear housing20 and the battery cover 84 are possible within the scope of theinvention. In the example shown, the door hooks along one side via thehooks shown on the far right side of FIG. 4. There are three of thesehooks and can be seen at the very bottom of FIG. 1, (not labeled). Thedoor is rotated down and two plastic catch features 189 shown in FIG. 1engage with a stamped metal leaf spring latch (not shown) that isassembled to housing 20. Feature 506 is a light detent to assist thelatch and keep that edge of the cover flat. Rather than hooking on oneside and latching on the other side, it will be recognized that the doorcould hook on the bottom edge and latch at the top edge, or vice-versaor that any suitable door configuration may be used.

A light guide 507 is secured to the user interface substrate 56 by thelight guide bracket 112. Several additional features of the display 52are illustrated. A back barrier film 508 is disposed between the userinterface substrate 56 and the user interface substrate adhesive layer60. The back barrier film 508 prevents moisture from entering thedisplay 52 from the back side of the user interface substrate 56. Asuitable dispensed sealant 512 is applied to the user interfacesubstrate 56 along the edge of the display 52. The dispensed sealant 512prevents moisture entry into the display 52. A front barrier film 516 isdisposed over the display to prevent moisture entry into the display 52.

FIG. 6 is a schematic diagram of part of a laminated front sub-assemblyof one example of a handset device depicting one embodiment of thedisplay 52 that includes by way of example an electrophoretic display ofa type such as an E Ink (trademark) imaging film based display producedby E Ink Corporation, Cambridge Mass., USA. An example of a laminationof the user interface substrate 56 and the display 52 is depicted alongwith additional adhesive and sealing or barrier layers as describedbelow. In this example, the display 52, includes a conductive laminationadhesive 608, an electrophoretic ink 612, an indium tin oxide coating616, and a front electrode sheet 620. The display 52 is laminated onto adisplay electrode pattern 604 (see FIG. 7), or back electrode pattern,residing on the user interface substrate 56. The display electrodepattern 604 may include, for example, a metal layer that is selectivelyetched. The selective etching leaves a display electrode pattern 604 andinterposed spaces 606 where the metal layer is removed from theunderlying user interface substrate 56.

The ITO coating 616 of the display 52 may be connected to pads, notshown, on the display electrode pattern 604 on the user interfacesubstrate 56 through a conductive epoxy. As known in the art,microcapsules in the electrophoretic ink 612 contain positively andnegatively charged white and black particles. Generally, when anappropriate voltage is applied between the display 52 and the ITOcoating 616 on display film 620 and the display (back) electrode pattern604, the white particles will be attracted to one electrode, and theblack particles will be attracted to the other electrode. The attractiveforce will move the particles to thereby cause parts of the display 52to appear either black or white. A front barrier film 516 which mayinclude an ultraviolet filter is disposed over the display to preventmoisture entry into the display 52.

Alternatively, thin film transistors may be used as the displayelectrode pattern (back electrode) as is the case for an active matrixelectrophoretic display. As described above, a back barrier sheet 508,front barrier film 516, further including a front barrier sheet 628 andan optically clear adhesive 624, and a dispensed sealant 512 may bedisposed to prevent moisture penetration into the display 52.

FIG. 7 is an exploded assembly view, shown from the front perspective,of part of the handset device of FIG. 1 depicting one embodiment of theinvention. The top surface 96 of the user interface substrate 56includes the display electrode pattern 604. The display electrodepattern 604 defines shapes, numbers, and pictures that will appear onthe display 52 when appropriate voltage is applied across the display 52and the display electrode 616 and electrodes pattern 604 (the front andback electrodes). The “background” of the display is, itself, an activeelectrode, so it can be driven to white or black. The keypad contactarray 108 is shown in greater detail. The speaker audio port 276 isdefined by the back barrier film 508. Also, there are labels 628 and 624in FIG. 7. The speaker audio port 278 is defined by the user interfacesubstrate 56. The display 52 is assembled to the user interfacesubstrate 56. The front barrier film 516 is assembled to the display 52.The dispensed sealant 512 is disposed around the perimeter of thedisplay 52. A cutout 708 in the layers of the display is adapted to atleast partially surround the area of the user interface substrate audioport 278. While a radius cutout 708 is depicted, it will be recognizedby those skilled in the art that various cutout shapes may be used,including shapes that completely surrounding the audio port 278.Lamination of an electrophoretic display 52 to a display electrodepattern 604 makes this design feature possible.

FIG. 8 is an exploded assembly view, shown from the rear perspective, ofthe handset device of FIG. 2 depicting one embodiment of the invention.The bottom surface 228 of the rear housing 20 and the bottom surface 208of the metal chassis 64, as assembled in the front laminate sub-assembly15, are shown in greater detail. The battery compartment 180 is definedby the rear housing 20. The rear housing 20 includes screw bosses 812.The laminated front sub-assembly 15 includes screw bosses 816 to retainscrews 92 and to thereby mechanically couple the rear housing 20 to thefront laminate sub-assembly 15. The integrated circuit substrate 24, andmicrophone 68 are attached to the metal chassis 64. Although shown inFIG. 8, charging jack 72 is assembled to rear housing 20, held in placeby support rib walls as shown in FIG. 1. Cut-outs in substrate 24 andmetal chassis 64 allow spring contacts on the charging jack to mate withcontacts pads on substrate 24. Tabs 804 defined on the rear housing 20operatively couple with the slots 808 defined on the metal chassis 64 toconnect the rear housing 20 and the front laminate sub-assembly 15. Itwill be recognized by one skilled in the art that other coupling shapescould be formed into to the front laminate sub-assembly 15 or the rearhousing 20. The gasket 296 operative to seal the speaker audio port 274is secured to the metal chassis 64. The gasket 296 may be adapted toform a first ring 822 surrounding and sealing the audio port 274 and asecond ring 826, larger than and surrounding the first ring 822 andsealing an audio cavity 1104 sealing the audio cavity at the interfaceof the chassis 64 to the back housing 20 (see FIG. 11 discussed below).Alternatively the first and second ring could be constructed fromseparate gaskets, which may be more suitable to an arrangement in whichaudio port 274 and the interface of the chassis 64 to the back housing20 are not in the same plane.

FIG. 9 is an exploded assembly view, shown from the front perspective,of part of the handset device of FIG. 1 depicting one embodiment of theinvention. The vertical stacking of audio ports 274 and 278 defined inthe laminated layers of the metal chassis 64 and the user interfacesubstrate 56 of the laminated front sub-assembly 15 are shown in greaterdetail. The display 52 partially surrounds the audio port 278 of theuser interface substrate 56. The speaker 32 is assembled under the audioport stack with the electrical connector 238 ported through theelectrical port 258 of the metal chassis 64. A medallion 916 with a meshscreen 920 is assembled into the sheet 36. When the sheet 36 isassembled to the user interface substrate 56, the mesh 920 forms thefinal audio port for the speaker 32.

FIG. 10 is an exploded assembly view, shown from the rear perspective,of part of the handset device of FIG. 2 depicting one embodiment of theinvention. The vertical stacking of speaker audio ports 274, 278, and282 defined in the laminated layers of the metal chassis 64, the userinterface substrate 56, and the sheet 36 of the laminated frontsub-assembly 15, respectively, is shown in greater detail. Gasket 296seals the audio port 274 for the speaker 32. The vertical stacking ofmicrophone audio port portions 286 and 288, and 292 defined in thelaminated layers of the metal chassis 64, and the user interfacesubstrate 56 of the laminated front sub-assembly 15, respectively, isshown in greater detail. The adhesive sheet 40 may be applied to theperimeter of the sheet 36. The keypad substrate 44 may be coupled to thesheet 36. The keypad array 48 may be coupled between the keypadsubstrate 44 and the user interface substrate 56. Electrical components1002, including drivers for the display 52, may be secured to the userinterface substrate 56. The microphone 68 may be secured to theintegrated circuit substrate 24. Screw bosses 1020 are defined in themetal chassis 64 to retain the screws 88 for attaching the integratedcircuit substrate 24.

FIG. 11 is a widthwise cross section of the speaker cavity of anassembled version of the handset device of FIG. 8 depicting oneembodiment of the invention. The diagram shows features of the audioporting and sealing in the handset device 10. The speaker 32 is coupledto the electrical contact 266 of the user interface substrate 56 by theelectrical connector 238 though a combined electrical port 263 thatincludes the electrical port 258 defined by the metal chassis 64 and theelectrical port defined by the user interface substrate adhesive layer60. The electrical connector 238 may be a spring contact, as shown, oranother type of pressure contact or other non pressure connector.Helical springs may be used, beam springs, elastomeric contacts or anysuitable connector may be used. The electrical connector 238 may be goldor gold plated.

The speaker audio port 320 over the speaker 32 includes the stackedaudio port portion 274 defined by the metal chassis 64, the audio portportion defined by the user interface substrate adhesive layer 60, theaudio port portion 278 defined by the user interface substrate 56, andthe audio port portion defined by the sheet 36. The user interfacesubstrate adhesive layer 60 is operative to separate the combinedelectrical port 263 from the combined audio port 320. That is, thepresence of the adhesive layer 60 prevents audio transmitted from thespeaker 32 through the combined audio port 320 from leaking back intothe handset device 10 through the combined electrical port 263. Inaddition, the gasket 296 is interposed between the speaker 32 and themetal chassis 64. The gasket 296 also prevents audio transmitted fromthe speaker 32 through the audio port 320 from leaking back into thehandset device 10 through the combined electrical port 263.

The rear housing 20 also may be adapted to provide an audio cavity 1104below the speaker 32. For example, the rear housing 20 may be adapted tosupport the speaker 32 on the internal side wall 182 of the rear housing20 while spacing the interior surface 1108 of the base wall 230 and theinterior surfaces 1112 of the external side walls 178 away from thespeaker 32. The audio cavity 1104 may increased the bass response (andloudness) of the speaker 32 which may be particularly useful when usingthe speaker 32 as a loudspeaker. The rear housing may further be adaptedto provide notches 1116 to support the gasket 296 on the exterior sidewalls 178. The gasket 296 may be adapted to form a first ring 822surrounding and sealing the audio port 274 and a second ring 826, largerthan and surrounding the first ring 822 that seals the audio cavity1104. It will be recognized by one skilled in the art that otherembodiments of the rear housing and gasket interface will work.Alternatively, separate walls could be formed in the rear housing toenclose the audio cavity 1104, rather than integrating these walls withthe side walls of the housing. Or, an entirely separate part could beused to form the side walls 1112 and back wall 1108 of the audio cavity,such as a molded elastomeric enclosure, which may allow elimination ofouter portion 826 of gasket 296. (c) Separate gaskets could be used toseal the speaker and the audio cavity. The gasket 296 may define a firstring seal around the speaker 32 and a second ring around the first ringto seal around the audio cavity 1104 (see FIG. 11) as is shown, forexample, in FIG. 8. The top antenna 76 and integral connectors 192 maybe located within audio cavity 1104, and coupled through openings in themetal chassis 64 and substrate adhesive layer 60 to the user interfacesubstrate 56, in a similar manner as the speaker 32 and electricalconnectors 238.

Referring to FIGS. 12 and 13, a keypad 1200 includes a plurality of keys1202 shown here to be in a bell keypad configuration having the numbers0-9 in addition to a “*”, “#” in addition to function keys such as powerkeys and other keys as shown. However, it will be recognized that anysuitable keypad configuration may be used. Also referring to FIG. 1, thekeypad 1200 includes a plurality of key dividers 1204, 1206, 1208, 1210that are positioned with respect to the plurality of keys 1202 and arefound on the keypad substrate 44 (see FIG. 1). Each of the plurality ofkey dividers 1204-1210 includes raised guide portions 1212, 1213 and1214 and tactile cue portions 1216 and 1218 that are interposed betweenthe plurality of raised guide portions 1212, 1213 and 1214. However, itwill be recognized that any suitable number (fewer or more) of raisedguide portions and tactile cue portions may be used. In this example,the number keys 1-9 are positioned in horizontal rows 1220 and the keysin the horizontal rows are positioned between parallel arced keydividers such as key dividers 1206 and 1208, or key dividers 1208 and1210 respectively.

In this example, the keypad 1200 also includes a segmented key divider1222 which is positioned above a plurality of keys, in this example thefirst row of number keys 1, 2, 3. The segmented key divider 1222 showstwo segmented portions 1224 and 1226. Also in this example, thesegmented key divider 1222 is positioned adjacent to the navigation key168. Other key dividers 1230 and 1232 may also be used as desired.

The tactile cue portions 1218 and 1216 provide lateral tactile cues fora finger or other object in the horizontal direction. In the exampleshown, a set of parallel arced key dividers also provides an arced railbetween which a finger may be guided. The tactile cue portions 1216 and1218 as shown in this example, are recessed with respect to theplurality of raised guide portions. However, it will be recognized thatthe tactile cue portions 1218 and 1216 may also be raised with respectto the plurality of raised guide portions 1214, 1213 and 1212. As notedabove, the keypad 1200 may be made in any suitable manner and in thisexample, includes the sheet 36, the keypad substrate 44, the keypadarray 48 and the patterned contacts 108 secured in a manner tofacilitate operation. The sheet 36 includes keypad indicia thereon andslots operatively sized to receive the plurality of arced key dividers.Although arced key dividers are shown, straight key dividers or othersuitably shaped key dividers may also be used.

As also shown, the tactile cue portions 1216 and 1218 are offset fromcenters of the keys. For example, the number 7 along with the letters“pqrs” associated with a key are centered with respect to itscorresponding raised guide portion and the corresponding tactile cueportion is offset from the center of the key.

Accordingly, many advantages of the above illustrated describedstructure will be recognized by those ordinary skilled in the art. Thesubstrate combines a display electrode pattern, such as is useful forlaminated display, and as the keypad contact array. This architectureprovides yield a thin, space efficient, and cost effective design thatis further useful as a component in a thin and cost effective handsetdevice. The substrate architecture facilitates designing a displayaround an audio port to create a unique appearance while implementing anecessary function in a space efficient manner.

The above detailed description of the invention, and the examplesdescribed therein, has been presented for the purposes of illustrationand description. While the principles of the invention have beendescribed above in connection with a specific device, it is to beclearly understood that this description is made only by way of exampleand not as a limitation on the scope of the invention.

1. A substrate for a handset device comprising: a keypad contact arrayon the substrate; and a display electrode pattern on the substrate. 2.The substrate of claim 1 further comprising a first surface and anopposing second surface wherein the keypad contact array and the displayelectrode pattern are both on the first surface.
 3. The substrate ofclaim 1 wherein the keypad contact array and the display electrodepattern comprise a conductive material.
 4. The substrate of claim 1further comprising a connector operatively coupled to the substrate. 5.The substrate of claim 1 further comprising a plurality of interconnectelectrical contact pads on the second surface substrate.
 6. Thesubstrate of claim 1 wherein a portion of the substrate defines at leasta portion of an audio port.
 7. A substrate for a handset devicecomprising: a first surface and a second surface; a keypad contact arrayon the first surface of the substrate wherein a portion of the substratedefines at least a portion of an audio port; a display electrode patternon the first surface of the substrate; and a display operatively coupledto the display electrode pattern.
 8. The substrate of claim 7 whereinthe display is configured to at least partly surround the audio portportion on the substrate.
 9. The substrate of claim 8 wherein thedisplay is an electrophoretic display.
 10. The substrate of claim 8further comprising a connector operatively coupled to the second surfaceof the substrate and a plurality of electrical contact pads on thesecond surface.
 11. The substrate of claim 8 further comprising at leastone integrated circuit operatively coupled to the bottom surface of thesubstrate.